ASYGN IC BARE DIES KIT

AS321X IC
Evaluation Kit

IC eval kit includes 100x fully tested bare dies for wirebonding or bumped in Gel pack or 10x QFN packaged parts. Component datasheet upon NDA

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+33 4 76 89 80 27

1 Place Firmin Gautier,
38000 Grenoble, France

COMPANY INFO

WITH THE SUPPORT OF: