Description
IC eval kit includes 100x fully tested bare dies for wirebonding or bumped
in Gel pack or 10x QFN packaged parts. Component datasheet upon NDA
Price range: 240,00 € through 2400,00 €
IC eval kit includes 100x fully tested bare dies for wirebonding or bumped
in Gel pack or 10x QFN packaged parts. Component datasheet upon NDA
AS3211 | AS3211-QFN |
---|---|
AS3212 | AS3212-QFN |
AS3213C | AS3213C-QFN |
AS3213S | AS3213S-QFN |
AS3213L | AS3213L-QFN |