IC eval kit includes 100x fully tested bare dies for wirebonding or bumped in Gel pack or 10x QFN packaged parts. Component datasheet upon NDA
AS3211-EVAL-DIE 100x AS3211 UHF RFID tag chips in waffle pack
AS3212-EVAL-DIE 100x AS3212 UHF RFID tag chips in waffle pack
AS3213-EVAL-DIE 100x AS3213 UHF RFID tag chips in waffle pack
AS3211-EVAL-QFN 10x AS3211 UHF RFID tag chips in QFN package
AS3212-EVAL-QFN 10x AS3212 UHF RFID tag chips in QFN package
AS3213-EVAL-QFN 10x AS3213 UHF RFID tag chips in QFN package
For customer outside France, we are shipping EXW Grenoble: we’ll notify you when the products are ready for pick-up in order you can organize the transport on your own. If you communicate us your freight forwarder details, we’ll be please to contact him on your behalf.
Alternatively, you can chose our “Transport” item in the quote, and we’ll take care of the shipment on a DPU basis.
For customers outside France ONLY: Transportation costs – Incoterm DPU